Light emitting device, resin-attached lead frame, and methods of manufacturing the same

ABSTRACT

A light emitting device includes: a base body including two conductive members, a resin body, and a fiber member placed inside the resin body, and a light-emitting element. The resin body includes an isolation section located between the two conductive members, and includes a pair of sandwiching portions sandwiching the isolation section. The fiber member has a length which is greater than a distance between the two conductive members, and is located at least in an adjoining region of at least one of the pair of sandwiching portions, the adjoining region adjoining the isolation section. In the adjoining region, the fiber member extends in a direction which is non-orthogonal to a direction in which that the pair of sandwiching portions extend.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of copending U.S. patent applicationSer. No. 16/392,106, filed Apr. 23, 2019, which claims priority toJapanese Patent Application No. 2018-082516, filed on Apr. 23, 2018, thedisclosure of which is hereby incorporated by reference in its entirety.

BACKGROUND

The present application relates to a light emitting device, aresin-attached lead frame, and methods of manufacturing the same.

Light emitting devices incorporating semiconductor light-emittingelements, e.g., light-emitting diodes (LED), are characterized by beingsmaller in size, having better power efficiency, and being longer-livedthan conventional filament-based light sources, and also characterizedby having good initial driving characteristics and withstandingrepetitive turning ON and OFF. Therefore, such light emitting devicesare used as light sources for various applications, such as displaydevices and lighting fixtures.

Such a light emitting device may include, for example, a base body (alsocalled a package) which is composed of leads and a resin molding, and alight-emitting element that is mounted on the base body. As is disclosedin e.g. Japanese Patent Publication No. 2012-89547, this type of lightemitting device is formed by an insert molding using a lead frame and awhite resin which is non light-transmitting but light-reflective, wherea plurality of resin moldings are formed on the lead frame at apredetermined interval, each resin molding having a recess in which alight-emitting element is to be mounted, and after the light-emittingelements are mounted in the recesses, lead frame and the resin moldingsare cut and singulated.

In a light emitting device having a base body as aforementioned, in somecases, the base body is expected to have improved strength.

SUMMARY OF INVENTION

The present disclosure provides a light emitting device and aresin-attached lead frame, these having a base body with improvedstrength, and methods of producing the same.

A light emitting device according to the present disclosure comprises: abase body including two conductive members each having an upper face anda lower face, a resin body covering a part of each conductive member,and a fiber member placed inside the resin body, a part of the upperface of each conductive member being exposed from the resin body at anupper side of the base body, and a part of the lower face of eachconductive member being exposed from the resin body at a lower side ofthe base body; and a light-emitting element electrically connected tothe two conductive members, wherein, the resin body includes anisolation section located between the two conductive members, andincludes a pair of sandwiching portions sandwiching the isolationsection; the fiber member has a length which is greater than a distancebetween the two conductive members, and is located at least in anadjoining region of at least one of the pair of sandwiching portions,the adjoining region adjoining the isolation section; and, in theadjoining region, the fiber member extends in a direction which isnon-orthogonal to a direction that the pair of sandwiching portionsextend.

According to the present disclosure, a light emitting device including abase body with improved base body strength can be realized.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a light emitting device according to afirst embodiment.

FIG. 2A is a plan view of a base body of the light emitting device inFIG. 1.

FIG. 2B is a side view of the base body of the light emitting device inFIG. 1.

FIG. 2C is a bottom view of the base body of the light emitting devicein FIG. 1.

FIG. 2D is a plan view of the base body of the light emitting device inFIG. 1.

FIG. 2E is a cross-sectional view of the base body taken at line 2E-2Ein FIG. 2A.

FIG. 2F is a cross-sectional view of the base body taken at line 2E-2Ein FIG. 2A.

FIG. 3A is a plan view of conductive members of the light emittingdevice in FIG. 1.

FIG. 3B is a side view of conductive members of the light emittingdevice in FIG. 1.

FIG. 3C is a front view of conductive members of the light emittingdevice in FIG. 1.

FIG. 4A is an upper plan view of a resin-attached lead frame which isused for manufacturing the light emitting device of FIG. 1.

FIG. 4B is a lower plan view of a resin-attached lead frame which isused for manufacturing the light emitting device of FIG. 1.

FIG. 4C is an enlarged upper plan view in which a part of aresin-attached lead frame which is used for manufacturing the lightemitting device of FIG. 1 is shown enlarged, and its internal structureis indicated with broken lines.

FIG. 5A is an upper plan view of a lead frame which is used formanufacturing the light emitting device of FIG. 1.

FIG. 5B is an upper plan view of a plurality of fiber members which areused for manufacturing the light emitting device of FIG. 1.

FIG. 5C is an upper plan view showing a plurality of fiber members beingplaced on a lead frame.

FIG. 5D is an enlarged cross-sectional view showing a lead frame andfiber members that are placed between dies.

FIG. 5E is an enlarged cross-sectional view showing a lead frame andfiber members that are placed between dies.

FIG. 6 is an upper plan view showing an example where fiber members arecomposed of a knotless net.

FIG. 7A is a plan view of a base body used in a light emitting deviceaccording to a second embodiment.

FIG. 7B is a side view of the base body used in a light emitting deviceaccording to a second embodiment.

FIG. 7C is a front view of the base body used in a light emitting deviceaccording to a second embodiment.

FIG. 7D is a bottom view of the base body used in a light emittingdevice according to a second embodiment.

FIG. 7E is a cross-sectional view of the base body taken at line 7E-7Ein FIG. 7A.

FIG. 7F is a cross-sectional view of the base body taken at line 7F-7Fin FIG. 7A.

FIG. 8A is an upper plan view of a resin-attached lead frame which isused for manufacturing a second light emitting device.

FIG. 8B is a lower plan view of a resin-attached lead frame which isused for manufacturing the second light emitting device.

FIG. 9A is an upper plan view of a lead frame which is used formanufacturing the second light emitting device.

FIG. 9B is a lower plan view of a lead frame which is used formanufacturing the second light emitting device.

FIG. 9C is an enlarged lower plan view of a lead frame which is used formanufacturing the second light emitting device.

FIG. 10 is a lower plan view showing a plurality of fiber members beingplaced on a lead frame which is used for manufacturing the second lightemitting device.

FIG. 11A is a plan view of a base body used in a light emitting deviceaccording to a third embodiment.

FIG. 11B is a side view of the base body used in a light emitting deviceaccording to a third embodiment.

FIG. 11C is a rear view of the base body used in a light emitting deviceaccording to a third embodiment.

FIG. 11D is a bottom view of the base body used in a light emittingdevice according to a third embodiment.

FIG. 11E is a cross-sectional view of the base body taken at line11E-11E in FIG. 11A.

FIG. 11F is a cross-sectional view of the base body taken at line11F-11F in FIG. 11A.

FIG. 11G is a cross-sectional view of the base body taken at line11G-11G in FIG. 11A.

FIG. 11H is a cross-sectional view of the base body taken at line11H-11H in FIG. 11A.

FIG. 12A is an upper plan view of a lead frame which is used formanufacturing a third light emitting device.

FIG. 12B is a lower plan view of a lead frame which is used formanufacturing the third light emitting device.

FIG. 13A is an upper plan view showing enlarged a plurality of fibermembers being placed on a lead frame which is used for manufacturing thethird light emitting device.

FIG. 13B is a lower plan view showing enlarged a plurality of fibermembers being placed on a lead frame which is used for manufacturing thethird light emitting device.

FIG. 14A is a plan view of a base body used in a light emitting deviceaccording to a fourth embodiment.

FIG. 14B is a side view of the base body used in a light emitting deviceaccording to the fourth embodiment.

FIG. 14C is a front view of the base body used in a light emittingdevice according to the fourth embodiment.

FIG. 14D is a bottom view of the base body used in a light emittingdevice according to the fourth embodiment.

FIG. 14E is a cross-sectional view of the base body taken at line14E-14E in FIG. 14A.

FIG. 14F is a cross-sectional view of the base body taken at line14F-14F in FIG. 14A.

FIG. 15A is an upper plan view showing enlarged a plurality of fibermembers being placed on a lead frame which is used for manufacturing afourth light emitting device.

FIG. 15B is a cross-sectional view showing enlarged the plurality offiber members being placed on a lead frame which is used formanufacturing a fourth light emitting device.

FIG. 16A is a plan view of a light emitting device according to a fifthembodiment.

FIG. 16B is a side view of the light emitting device according to thefifth embodiment.

FIG. 16C is a front view of the light emitting device according to thefifth embodiment.

FIG. 16D is a bottom view of the light emitting device according to thefifth embodiment.

FIG. 16E is a cross-sectional view of the base body taken at line16E-16E in FIG. 16A.

FIG. 17A is a plan view of a base body used in the light emitting deviceaccording to the fifth embodiment.

FIG. 17B is a side view of the base body used in the light emittingdevice according to the fifth embodiment.

FIG. 17C is a front view of a base body used in the light emittingdevice according to the fifth embodiment.

FIG. 17D is a bottom view of a base body used in the light emittingdevice according to the fifth embodiment.

FIG. 17E is a cross-sectional view of the base body taken at line17E-17E in FIG. 17A.

FIG. 17F is a cross-sectional view of the base body taken at line17F-17F in FIG. 17A.

FIG. 18 is a plan view showing enlarged the placement of a plurality offiber members and a lead frame which is used for manufacturing a lightemitting device according to the fifth embodiment.

DETAILED DESCRIPTION

When a semiconductor device having a base body is mounted on e.g. aprinted circuit board, a light emitting device which is supplied from afeeder unit of a chip mounter (surface mounter) is picked up by a nozzle(collet) of the chip mounter, and the semiconductor device having beenpicked up is mounted on an intended place on the printed circuit board.At this time, the package of the semiconductor device is stressed by thenozzle.

The resin molding composing the base body may contain a filler in orderto achieve a high light-shielding ability or light reflectivity.However, as the content ratio of the filler increases, the strength ofthe resin molding may lower. Therefore, when the semiconductor devicepossesses a package utilizing a resin molding that profusely containsfiller, the package of the light emitting device may be stressed by thepickup nozzle of a chip mounter during mounting, such that fissures,cracks, etc., may occur in the resin molding. In the presence of suchfissures or breaking, wire breaks or the like may occur, thus causingmalfunctioning of the light emitting device, or lowering hermeticity ofthe light emitting device and degrading reliability.

In view of such problems, a light emitting device according to thepresent disclosure possesses a package having a base body with a resinmolding whose strength is enhanced with a fiber member(s). Hereinafter,embodiments of light emitting devices according to the presentdisclosure will be described in detail.

First Embodiment

[Structure of the Light Emitting Device]

FIG. 1 is a perspective view of a light emitting device 101 according tothe present disclosure. The light emitting device 101 includes a basebody 11, a light-emitting element 50, and a sealing member 60. Therespective component elements will be described in detail below. Thebase body 11 has a recess 11 r, such that the light-emitting element 50is placed at the bottom of the recess 11 r. The sealing member 60 coversthe light-emitting element 50, and is placed inside the recess 11 r.

[Base Body]

The base body 11 functions as a housing for retaining the light-emittingelement 50. The base body 11 is also called a package. It also providesterminals for electrically connecting the light-emitting element 50 withthe outside of the light emitting device 101. FIGS. 2A, 2B, 2C, and 2Dare respectively a plan view, a side view, a bottom view, and a rearview of the base body 11; and FIGS. 2E and 2F are cross-sectional viewsof the base body 11 taken at line 2E-2E and line 2F-2F in FIG. 2A,respectively.

The base body 11 includes a resin body 20, conductive members 30, andfiber members 40. As will be described later, the base body 11 isintegrally formed of the resin body 20, the conductive members 30, andthe fiber members 40.

The base body 11 has an upper face 10 a and a lower face 10 b which islocated at the opposite side to the upper face 10 a. In the presentembodiment, in top view, the base body 11 has a substantiallyrectangular outer shape. Therefore, the base body 11 has four outerlateral faces: an outer lateral face 10 c, an outer lateral face 10 dwhich is located at the opposite side to the outer lateral face 10 c, anouter lateral face 10 e, and an outer lateral face 10 f which is locatedat the opposite side to the outer lateral face 10 e. The outer shape ofthe base body 11 in top view is not limited to a rectangle, but may beany other shape. Moreover, the base body 11 may have an anode mark (or acathode mark) 10 m that is formed by removing a portion off one of thecorners of the upper face 10 a. The anode mark 10 m functions as a markindicating the polarities of the two conductive members 30.

The recess 11 r opens in the upper face 10 a of the base body 11. At thebottom face of the recess 11 r, a part of an upper face 31 a of thefirst conductive member 31 (mentioned below) and a part of an upper face32 a of the second conductive member 32 (mentioned below) are locatedand exposed. At the lower face 10 b of the base body 11, a part of alower face 31 b of the first conductive member 31 and a part of a lowerface 32 b of the second conductive member 32 are exposed.

[Conductive Member]

In the present embodiment, the conductive members 30 include a firstconductive member 31 and a second conductive member 32. The firstconductive member 31 has an upper face 31 a and a lower face 31 b whichis located at the opposite side to the upper face 31 a. The secondconductive member 32 has an upper face 32 a and a lower face 32 b whichis located at the opposite side to the upper face 32 a. The firstconductive member 31 and the second conductive member 32 are placed sideby side, such that the lower face 31 b and the lower face 32 b aresubstantially coplanar with each other. Between the first conductivemember 31 and the second conductive member 32, an isolation section 21 jof the resin body 20 as will be described below is located.

FIGS. 3A, 3B, and 3C are a plan view, a side view, and a front view,respectively, of the conductive members 30. The first conductive member31 and the second conductive member 32 are electrically conductive, andfunction as electrodes for supplying power to the light-emitting element50. Although the present embodiment illustrates the conductive members30 as including the first conductive member 31 and the second conductivemember 32, the conductive members 30 may include a third conductivemember in addition to the first conductive member 31 and the secondconductive member 32. The third conductive member may function as anelectrode, or function as a heat dissipation member with high thermalconductivity.

In the present embodiment, the first conductive member 31 and the secondconductive member 32 each have a substantially rectangular shape.

The first conductive member 31 includes lateral portions 31 c, 31 d, 31f, and 31 e. At the lower face 31 b side, the first conductive member 31has a lateral peripheral groove 31 g in the lateral portions 31 c, 31 d,31 f, and 31 e.

Similarly, the second conductive member 32 includes lateral portions 32c, 32 d, 32 f, and 32 e. At the lower face 32 b side, the secondconductive member 32 has a lateral peripheral groove 32 g in the lateralportions 32 c, 32 d, 32 f, and 32 e. The lateral peripheral grooves 31 gand 32 g can formed by an etching process, a pressing process, or thelike.

From each of the lateral portions 31 c, 31 d, and 31 f of the firstconductive member 31, an extending portion(s) 31 h is provided. In thepresent embodiment, two extending portions 31 h are provided on each ofthe lateral portions 31 c and 31 d. Similarly, one extending portion 32h is provided from each of the lateral portions 32 c, 32 d, and 32 e ofthe second conductive member 32. Each extending portion extends towardthe outer lateral face 10 c, 10 d, 10 e, or 10 f.

The lateral portion 31 e of the first conductive member 31 and thelateral portion 32 f of the second conductive member 32, each of whichhas no extending portion, are opposed to each other via a gap. In thisgap, a part of the resin body 20 is located, as will be described later.Moreover, the extending portion 31 h and the lateral peripheral groove31 g of the first conductive member 31 and the extending portion 32 hand the lateral peripheral groove 32 g of the second conductive member32 are embedded inside the resin body 20.

The lateral peripheral grooves 31 g and 32 g which are made in the firstconductive member 31 and the second conductive member 32 are provided inorder to promote adhesion between the resin body 20 and the firstconductive member 31 or second conductive member 32. In thebelow-described lead frame, the extending portions 31 h and 32 h are apart of a connecting portion that allows sites to become the firstconductive member 31 and the second conductive member 32 to beinterconnected to an outer frame portion.

In the present embodiment, in top view, the first conductive member 31has a greater area than does the second conductive member 32. This isbecause the light-emitting element 50 is to be disposed on the firstconductive member 31. However, in the case where the light-emittingelement 50 is placed on the second conductive member 32, the area of thesecond conductive member 32 may be greater than the area of the firstconductive member 31 in top view. Further the light-emitting element 50may be provided across both of the first conductive member 31 and thesecond conductive member 32. In this case, in top view, the firstconductive member 31 and the second conductive member 32 may havesubstantially the same area.

Each of the first conductive member 31 and the second conductive member32 includes a substrate and a metal layer covering the substrate. Thesubstrate is preferably a plate-like member. The substrate may contain ametal such as copper, aluminum, gold, silver, iron, nickel, or an alloythereof; phosphor bronze; iron-containing copper; or the like. These maybe of a single layer, or have a multilayer structure (e.g., a cladmaterial). Copper, which is inexpensive and has high heat-releasingability, is particularly preferably used for the substrate. The metallayer may contain e.g. silver, aluminum, nickel, palladium, rhodium,gold, copper, or an alloy thereof, etc. Further each of the firstconductive member 31 and the second conductive member 32 may have aregion where no metal layer is provided. Regarding the first conductivemember 31 and the second conductive member 32, the metal layer that isformed on the upper faces 31 a and 32 a may be different from the metallayer that is formed on the lower faces 31 b and 32 b. For example, themetal layer formed on the upper faces 31 a and 32 a may be a metal layerconsisting of multiple layers including a metal layer of nickel, whilethe metal layer formed on the lower faces 31 b and 32 b may be a metallayer that does not include a metal layer of nickel.

Moreover, in the case where a plating layer of silver or a silver alloyis formed on the outermost surface of the first conductive member 31 andthe second conductive member 32, preferably a protective layer ofsilicon oxide or the like is provided on the surface of the platinglayer of silver or a silver alloy. This can suppress the plating layerof silver or a silver alloy from discoloring because of a sulfurcomponent, etc., in the atmospheric air. As the film formation methodfor the protective layer, a vacuum process such as sputtering may beused, but any other known method may also be used. The protective layermay be formed after the light-emitting element 50 is mounted andfurnished with wire connections and before the sealing member 60 isformed, or, formed in a part or a whole of the surface of the sealingmember 60 after the sealing member 60 is formed.

[Resin Body]

The resin body 20 includes a pair of sandwiching portions 21 c and 21 d,a pair of interconnecting portions 21 e and 21 f, and an isolationsection 21 j. The isolation section 21 j is disposed between the firstconductive member 31 and the second conductive member 32, and retains agap between the first conductive member 31 and the second conductivemember 32 while keeping the first conductive member 31 and the secondconductive member 32 spaced apart, whereby the first conductive member31 and the second conductive member 32 are separated. The sandwichingportions 21 c and 21 d are placed so that the isolation section 21 j andthe conductive members 30 (i.e., the first conductive member 31 and thesecond conductive member 32) are sandwiched therebetween. Theinterconnecting portions 21 e and 21 f are connected to both ends of thesandwiching portions 21 c and 21 d, thereby interconnecting thesandwiching portions 21 c and 21 d. Moreover, the interconnectingportions 21 e and 21 f are placed so that the first conductive member 31and the second conductive member 32 are interposed therebetween. Thesandwiching portions 21 c and 21 d and the interconnecting portions 21 eand 21 f constitute a frame shape surrounding the recess 11 r; as aresult of this, at the bottom face of the recess 11 r (that is, at anupper side of the resin body 20), a part of the upper face 31 a of thefirst conductive member 31 and a part of the upper face 32 a of thesecond conductive member 32, and the isolation section 21 j are exposed.At a lower side of the resin body 20, a part of the lower face 31 b ofthe first conductive member 31 and a part of the lower face 32 b of thesecond conductive member 32, and the isolation section 21 j are exposed.

The sandwiching portions 21 c and 21 d have adjoining regions 21 cr and21 dr, respectively, that adjoin the isolation section 21 j. Thesandwiching portion 21 c and the sandwiching portion 21 d have the outerlateral face 10 c and the outer lateral face 10 d, respectively. Theinterconnecting portion 21 e and the interconnecting portion 21 f havethe outer lateral face 10 e and the outer lateral face 10 f,respectively.

The resin body 20 is made of a thermosetting resin, for example. Apreferable thermosetting resin is at least one selected from the groupconsisting of an epoxy resin, a modified epoxy resin, a silicone resin,a modified silicone resin, an acrylate resin, and an urethane resin. Inparticular, epoxy resins, modified epoxy resins, silicone resins,modified silicone resins, and the like can be used. Alternatively, theresin body 20 may be made of a thermoplastic resin.

In addition to the resin, the resin body 20 may also contain a filler,an acid anhydride, an antioxidant, a release agent, a curing catalyst, alight stabilizer, a lubricant, and the like. For example, as a filler,particles, short fibers, etc., of a light-reflective substance or alight-shielding substance may be dispersed in a thermosetting resin.Other than adjusting the optical properties as mentioned above, thefiller may also be used for adjusting thermal properties such as thermalconductivity of the resin.

Examples of particles of a light-reflective substance that may be usedas the filler include particles of titanium oxide, silicon oxide,zirconium oxide, magnesium oxide, calcium carbonate, calcium hydroxide,calcium silicate, zinc oxide, barium titanate, potassium titanate,alumina, aluminum nitride, boron nitride, mullite, and the like. Byusing particles of any such material, light can be efficientlyreflected. Examples of particles of a light-shielding substance to beused as the filler include coloring pigment particles containing carbonblack or a transition metal compound. As the filler, each of these maybe used alone, or two or more of them may be used in combination. Thisallows the light reflectance and light-shielding ability of the resincontaining the filler to be adjusted, and also the coefficient of linearexpansion of the resin to be adjusted.

[Fiber Member]

The fiber members 40 are located inside the adjoining region(s) 21 crand/or 21 dr of at least one of the sandwiching portions 21 c and 21 d.Inside the adjoining region 21 cr or the adjoining region 21 dr, thefiber members 40 extend in a direction which is non-orthogonal to thedirection L that the sandwiching portion 21 c or the sandwiching portion21 d extends. A direction which is orthogonal to the direction L thatthe sandwiching portion 21 c or 21 d extends may be any direction on aplane P that is perpendicular to the direction L; therefore, to “extendin a direction which is non-orthogonal” thereto means extending in anydirection that is not on the plane P. In other words, the direction thatthe fiber members 40 extend makes an angle θ of 0° or more but less than90° with the direction L that the sandwiching portion 21 c or 21 dextends. As will be described later, from the standpoint of enhancingthe strength of the sandwiching portion 21 c or 21 d, the angle θ ispreferably small. For example, the angle θ is preferably not less than0° and not more than 15°, more preferably not less than 0° and not morethan 10°, and still more preferably not less than 0° and not more than5°.

In the present embodiment, as shown in FIGS. 2A, 2B, 2C, 2D, 2E, and 2F,one of the fiber members 40 is located inside the sandwiching portion 21c, including inside the adjoining region 21 cr of the sandwichingportion 21 c. Another fiber member 40 is located inside the sandwichingportion 21 d, including inside the adjoining region 21 dr of thesandwiching portion 21 d. The fiber members 40 located inside theadjoining regions 21 cr and 21 dr each have a length greater than adistance between the first conductive member 31 and the secondconductive member 32. More specifically, the base body 11 includes fourfiber members 40, such that the four fiber members 40 are respectivelyembedded in the sandwiching portions 21 c and 21 d and theinterconnecting portions 21 e and 21 f, along the directions that thesandwiching portions 21 c, 21 d, 21 e, and 21 f extend. Since the fibermembers 40 are embedded in the sandwiching portions 21 c and 21 d alongthe direction L that the sandwiching portion 21 c or 21 d extends, thedirection that the fiber members 40 extend is parallel to the directionL that the sandwiching portion 21 c or 21 d extends. In other words, thedirection that the fiber members 40 in the sandwiching portions 21 c and21 d extend is a direction which is non-orthogonal to the direction thatthe sandwiching portion 21 c or 21 d extends. This further enhances thestrength of the base body 11.

End faces of the fiber members 40 embedded in the sandwiching portions21 c and 21 d are exposed at the outer lateral faces 10 e and 10 f. Endfaces of the fiber members 40 embedded in the interconnecting portions21 e and 21 f are exposed at the outer lateral faces 10 c and 10 d.Moreover, within the sandwiching portions 21 c and 21 d and theinterconnecting portions 21 e and 21 f, the fiber members 40 are locateddownward (i.e., closer to the lower face 10 b) of the extending portions31 h and 32 h of the first conductive member 31 and the secondconductive member 32). Preferably, the fiber members 40 are closelylocated to the lower face 10 b, for greater enhancement in the strengthof the base body 11. Moreover, the fiber members 40 may be locatedupward (i.e., closer to the upper face 10 a) of the extending portions31 h and 32 h).

Each fiber member 40 may be a monofilament, or a bundle of multiplefibers, e.g., a parallel fiber bundle or a twisted thread. From thestandpoint of capability of impregnation with resin and the standpointof joining with the resin, a bundle of fibers is more preferable. In thecase where the fiber member 40 is a monofilament, the direction that thefiber member 40 extends coincides with the direction of themonofilament. In the case where the fiber member 40 is a bundle offibers, the direction that the fiber member 40 extends may notnecessarily coincide with the direction of the respective fibersconstituting the bundle of fibers. A twisted thread can be formed bystranding together short fibers or long fibers. When twisted, theorientation of each fiber in the bundle of fibers will not be identicalwith the direction that the bundle of fibers itself extends; it will beinclined in the case of short fibers, or helical in the case of longfibers. As the fibers in a bundle of fibers, organic fibers such asglass fibers, carbon fibers, or aramid fibers (synthetic fibers ornatural fibers) may be used. One kind of fiber, or a combination of aplurality of kinds of fibers may be used. Long fibers are preferable toshort fibers, because the initial tensile resistance (apparent Young'smodulus, initial elastic modulus) of the fiber members 40 will beincreased.

In order to keep the bundle of fibers together, or improve its handling,each fiber member 40 may contain resin, such that a monofilament or abundle of fibers is impregnated with the resin. Moreover, as will bedescribed later, each fiber member 40 may constitute a knotless net, aplain weave, or the like. The thickness of each fiber member 40 ispreferably smaller than the depth of the lateral peripheral grooves 31 gand 32 g. A knotless net is fibers being stranded (or woven) into a netform, including e.g. a perforation type knotless net, a staggeredknotless net, a hexagonal knotless net, a Raschel net, a minnow net, andthe like. A knotless net is preferable because it has not knots andtherefore presents planar joints.

[Light-Emitting Element]

As the light-emitting element 50, a semiconductor light-emitting elementsuch as a light-emitting diode device can be used. Although the presentembodiment illustrates that the light emitting device 101 includes onelight-emitting element, it may include two light-emitting elements, orthree or more light-emitting elements. It is particularly preferablethat the light-emitting element 50 contains a III-V group compoundsemiconductor, e.g., a nitride semiconductor (In_(x)Al_(y)Ga_(1-x-y)N,0≤x, 0≤y, x+y≤1), that is capable of light emission in the ultravioletto visible ranges.

In the recess 11 r, the light-emitting element 50 is connected to thefirst conductive member 31 by a connecting member, thus being disposedon the first conductive member 31. The connecting member may be, forexample: resins including the resin materials exemplified for the resinbody 20; tin-bismuth based, tin-copper based, tin-silver based, gold-tinbased, or other solders; electrically conductive pastes or bumps, e.g.,silver, gold, or palladium; or brazing materials such as anisotropicconductive materials or low-melting point metal materials. Thelight-emitting element 50 and the first conductive member 31 and thesecond conductive member 32 may also be electrically connected via wires51 and 52.

[Sealing Member]

The sealing member 60 transmits light from the light-emitting element50, and yet protects the light-emitting element 50 from the externalenvironment. As the sealing member, a resin, glass, etc., that isselected from the group consisting of epoxy resins, modified epoxyresins, silicone resins, modified silicone resins, acrylate resins, andurethane resins can be used.

In order to confer certain functions to the sealing member 60, thesealing member 60 may contain at least one selected from the groupconsisting of a wavelength-converting substance, a filler, a diffusingagent, a pigment, a fluorescent substance, and a reflective substance.As the diffusing agent, barium titanate, titanium oxide, aluminum oxide,silicon oxide, or the like can be suitably used. For the purpose ofsuppressing light of unwanted wavelengths, an organic or inorganiccoloring dye or a coloring pigment may be contained. Awavelength-converting substance absorbs light from the semiconductorlight-emitting element, and effects wavelength conversion into light ofa different wavelength, which may be e.g. particles of nitride-basedphosphor, oxynitride-based phosphor, SiAlON-based phosphor, or the like.One kind of wavelength-converting substance, or two or more kinds ofwavelength-converting substances in combination, may be used in order torealize not only blue, green, yellow, red, etc., but also intermediatecolors therebetween, such as blue-green, yellow-green, orange, etc.

The light emitting device 101 may further include a protection elementsuch as a Zener diode. In this case, the protection element can beplaced on the first conductive member 31 or the second conductive member32. In this case, within the recess 11 r, the protection element is alsocovered by the sealing member 60. Alternatively, the protection elementmay be placed inside the resin body 20.

[Characteristic Aspects of the Light Emitting Device]

In the light emitting device 101, the isolation section 21 j of theresin body 20 is located in the gap between the first conductive member31 and the second conductive member 32. Therefore, as the light emittingdevice 101 is picked up by a chip mounter, etc., during mounting of thelight emitting device 101, the base body 11 of the light emitting device101 may be stressed, thereby likely causing fissures, cracks, etc., atthe position of the isolation section 21 j. In the light emitting device101 according to the present disclosure, the fiber members 40 are placedin the adjoining regions 21 cr and 21 dr of the sandwiching portions 21c and 21 d, which adjoin the isolation section 21 j, whereby thestrength of the adjoining regions 21 cr and 21 dr of the sandwichingportions 21 c and 21 d is enhanced, so that fissures, cracks, etc., dueto stress can be suppressed. Moreover, since the fiber members 40 areplaced in the entirety of each sandwiching portion 21 c, 21 d and eachinterconnecting portion 21 e, 21 f, the strength of the entire resinbody 20 is enhanced. As a result, with the light emitting device 101according to the present disclosure, malfunctioning due to externalforce is suppressed, and reliability can be enhanced. Moreover, variousfillers may be adequately added to the resin body 20 in order to conferthereto functions such as light reflectivity, light-shielding ability,etc.; thus, optical characteristics of the light emitting device 101 canbe further enhanced.

[Method of Manufacturing the Light Emitting Device]

The light emitting device 101 can be produced by: step (A) ofmanufacturing a resin-attached lead frame in which base bodies 11 asaforementioned are integrated; step (B) of placing a light-emittingelement 50 in the recess 11 r of each base body 11 in the resin-attachedlead frame, and electrically connecting the light-emitting element 50with a first conductive portion to become the first conductive member 31and a second conductive portion to become the second conductive member32; step (C) of placing a sealing member 60 so as to cover thelight-emitting element 50 in the recess 11 r; and step (D) ofsingulating the resin-attached lead frame by cutting it along cut lines,thereby obtaining individual light emitting devices 101. Hereinafter,the respective steps will be described in order.

Step (A)

[Structure of the Resin-Attached Lead Frame and Method of Manufacturingthe Resin-Attached Lead Frame]

FIG. 4A and FIG. 4B are an upper plan view and a lower plan view,respectively, of the resin-attached lead frame 151. FIG. 4C is anenlarged upper plan view in which a part of the resin-attached leadframe is shown enlarged, and its internal structure is indicated withbroken lines. FIG. 5A is an upper plan view of a lead frame which isused for the resin-attached lead frame 151. In these figures, for easeof understanding, three-dimensional directions are indicated by aright-hand orthogonal coordinate system. Specifically, in each diagram,the downward direction along the vertical direction is represented asthe x axis, whereas the rightward direction, which is perpendicular tothe x axis, is represented as the y axis. Moreover, a direction which isperpendicular to the x axis and they axis and coming out of the plane ofthe figure is defined as the z axis. These may instead be referred to asthe first, second, and third axes. The first axis and the second axismay not be orthogonal to each other. Moreover, any arrangement along thex axis direction will be referred to as a column, and any arrangementalong the y axis direction will be referred to as a row. A directionwhich is parallel to the x axis direction may be referred to as thefirst direction; a direction which is parallel to the y axis directionmay be referred to as the second direction; and a direction which isparallel to the z axis direction may be referred to as the thirddirection.

The resin-attached lead frame 151 includes a lead frame 201, a resinmember 220, and fiber members 40. The lead frame 201 includes aplurality of conductive portions 230. The plurality of conductiveportions 230 are arrayed along the x axis and the y axis direction. Eachconductive portion 230 includes a plurality of conductive subportionsthat are arranged along the x axis direction. In the present embodiment,each conductive portion 230 includes a first conductive subportion 231and a second conductive subportion 232. The first conductive subportion231 has an upper face 231 a and a lower face 231 b, whereas the secondconductive subportion 232 has an upper face 232 a and a lower face 232b. When the resin-attached lead frame 151 is singulated, i.e., separatedinto a plurality of base bodies 11, the first conductive subportion 231and the second conductive subportion 232 are to become the firstconductive member 31 and the second conductive member 32 of each basebody 11.

In the lead frame 201, the first conductive subportions 231 and thesecond conductive subportions 232 are alternately arranged along the xaxis direction. A plurality of first conductive subportions 231 arearranged along the y axis direction, and a plurality of secondconductive subportions 232 are arranged along the y axis direction.Along the x axis direction, the first conductive subportion 231 and thesecond conductive subportion 232 of each conductive portion 230 arespaced apart from each other by a gap 230 j in which the isolationportion 223 of the resin member is placed. At the lower face side of thefirst conductive subportion 231 and the second conductive subportion232, lateral peripheral grooves 231 g and 232 g corresponding to thelateral peripheral grooves 31 g and 32 g are provided.

Each conductive portion 230 is connected to an adjacent conductiveportion 230 along the x axis direction or the y axis direction, viaconnecting portions 231 h, 232 h and 235 h. In the present embodiment,the first conductive subportion 231 is connected to the first conductivesubportion 231 of an adjacent conductive portion 230 on the right (orleft) side along the y axis direction, via two connecting portions 231h. The second conductive subportion 232 is connected to the secondconductive subportion 232 of an adjacent conductive portion 230 on theright (or left) side along the y axis direction, via a single connectingportion 232 h. On the other hand, along the x axis direction, the firstconductive subportion 231 is connected to the second conductivesubportion 232 of an adjacent conductive portion 230 via a connectingportion 235 h. Regarding the z axis direction, each conductive portion230 has an upper face and a lower face.

The array of plural sets of conductive portions 230 along the x axisdirection and the y axis direction is connected, by connecting portions231 h, 232 h and 235 h, to an outer frame portion 240 that surrounds thearray of plural sets of conductive portions 230.

By using a plate made of any of the materials exemplified for thesubstrate of the first conductive member 31 and the second conductivemember 32, the lead frame 201 can be formed by performing a stampingprocess, an etching process, or the like to create incisions, steps, andconcavities and convexities. The incisions, steps, and concavities andconvexities can be created by combining stamping processes and/orpressing processes. In the case where etching processes are to beperformed, an etching process to penetrate through the lead frame and aone-sided etching process which stops short of penetration may becombined to create the incisions, steps, and concavities andconvexities. Thereafter, the surface of the plate of the processedsubstrate may be covered with a metal layer, thereby providing the leadframe 201. As obtained above, the lead frame is provided.

The resin member 220 includes a plurality of first portions 221, aplurality of second portions 222 (see FIGS. 4A and 4B), and a pluralityof isolation portions 223. Each first portion 221 extends along thefirst direction, and is placed between each column of conductiveportions 230 that are arranged along the x axis direction. Each secondportion 222 extends along the second direction intersecting the firstdirection, and is placed between each row of conductive portions 230that are arranged along the y axis direction. Each isolation portion 223is placed between the first conductive subportion 231 and the secondconductive subportion 232 of the respective conductive portion 230. Thefirst portions 221 and the second portions 222 surround each conductiveportion 230 and each isolation portion 223, thereby constituting alatticework portion 234. On the upper face side of the latticeworkportion 234, a plurality of recesses 211 r each corresponding to therecess 11 r of the base body 11 are located. At the bottom face of eachrecess 211 r, a part of the upper face 231 a of the first conductivesubportion 231 and a part of the upper face 232 a of the secondconductive subportion 232 are exposed. Also, the isolation portion 223is exposed at the bottom of the recess 211 r. On the lower face side ofthe latticework portion 234, a part of the lower face 231 b of the firstconductive subportion 231 and a part of the lower face 232 b of thesecond conductive subportion 232 are exposed. One end and the other endof each isolation portion 223 are connected to the respective firstportions 221 on its right and left sides, such that each first portion221 includes an adjoining region 221 r (see FIG. 4C) adjoining theisolation portion 223.

When the resin-attached lead frame 151 is singulated, i.e., separatedinto a plurality of base bodies 11, the resin member 220 becomes theresin body 20 of each base body 11. Moreover, the first portions 221become the sandwiching portions 21 c and 21 d of each resin body 20, andthe second portions 222 become the interconnecting portions 21 e and 21f of each resin body 20. The resin member 220 is made of the material ofthe resin body 20 as aforementioned.

Within each first portion 221 of the resin member 220, fiber members 40are placed, at least inside the adjoining region 221 r. Each fibermember 40 placed inside the adjoining region 221 r has a length which isgreater than a distance between the first conductive subportion 231 andthe second conductive subportion 232. The fiber members 40 extend in adirection which is non-orthogonal to the x axis direction. Since thefirst portions 221 extend along the first direction which is parallel tothe x axis direction, the fiber members 40 extend so as to intersect theyz plane, which is perpendicular to the x axis. In the presentembodiment, fiber members 40 are placed on each of the four sidessurrounding each recess 211 r of the resin member 220. Specifically,each first portion 221 has two fiber members 40 embedded therein, suchthat the two fiber members 40 respectively adjoin the two columns ofconductive portions 230 that are adjacent to the first portion 221 onits both sides along the y axis direction. Moreover, each second portion222 has two fiber members 40 embedded therein, such that the two fibermembers 40 respectively adjoin the two rows of conductive portions 230that are adjacent to the second portion 222 on its both sides along thex axis direction.

In the resin-attached lead frame 151, the two fiber members 40 areembedded inside the adjoining region 221 r of each first portion 221. Asa result, when the resin-attached lead frame 151 is singulated into basebodies 11 by cutting each first portion 221 apart between the two fibermembers 40 (and also cutting apart each second portion 222), the basebodies 11 will possess the aforementioned characteristic aspects.

The resin-attached lead frame 151 is produced by insert molding, forexample.

First, as shown in FIG. 5A, the lead frame 201 having theabove-described structure is provided. Moreover, as shown in FIG. 5B, anarray of plural fiber members 40 arranged along the x axis direction andthe y axis direction is provided. At this time, the plurality of fibermembers 40 may be arrayed along the x axis direction and the y axisdirection; the fiber members 40 may be impregnated with resin so thattheir respective positions are temporarily fixed; and the resin may besemi-cured while the fiber members 40 are kept in the predeterminedpositions, for better temporary fixation.

Thereafter, as shown in FIG. 5C, the lead frame 201 is overlaid on theplurality of fiber members 40. The plurality of fiber members 40 arealigned so as to overlap the connecting portions 231 h, 232 h, and 235 hof the lead frame 201 in top view.

Thereafter, as shown in FIG. 5D and FIG. 5E, the lead frame 201 and thefiber members 40 having been aligned are sandwiched between an upper die261 and a lower die 262. As shown in FIG. 5D, the fiber members 40 areplaced in a region below the connecting portions 231 h, 232 h and 235 h(FIG. 5C); and as shown in FIG. 5E, where the connecting portions 231 h,232 h, and 235 h do not exist, the fiber members 40 are placed closelyto the lateral peripheral grooves 231 g and 232 g. Cavities are createdby the sandwiching positioning of the upper die 261 and the lower die262. The cavities are spaces corresponding to the sandwiching portions21 c and 21 d, the interconnecting portions 21 e and 21 f, and theisolation sections 21 j of the resin bodies 20. Regions of the upperface 201 a of the lead frame 201 that are in contact with the upper die261 are regions of the conductive members 30 that will become exposed atthe respective bottom faces of the recesses 211 r. Regions of the lowerface 201 b of the lead frame 201 that are in contact with the lower die262 are regions of the conductive members 30 that will become exposed atthe respective lower faces of the base bodies 11.

Next, in the cavities sandwiched between the upper die 261 and the lowerdie 262, an uncured material of the resin body 20 is injected andheated, thereby allowing the uncured material of the resin body 20 tocure. Thereafter, the dies 261 and 262 are removed, whereby theresin-attached lead frame 151 is completed.

Step (B)

The light-emitting elements 50 are placed on the lead frame 201. Eachlight-emitting element 50 is joined to the first conductive subportion231 that is exposed in the respective recess 211 r in the resin-attachedlead frame 151. Furthermore, each light-emitting element 50 is connectedto the first conductive subportion 231 and the second conductivesubportion 232 via wires 51 and 52.

Step (C)

Furthermore, an uncured material of the sealing member 60 is injected ineach recess 211 r so as to cover the light-emitting element 50 and thewires 51 and 52, and thereafter cured, thus allowing the sealing member60 to be placed within the recesses 211 r.

Step (D)

In order to effect singulation, the resin-attached lead frame 151 is cutalong cut lines which are indicated with dot-dash lines in FIG. 4C. Theresin member 220 and the fiber members 40 of the resin-attached leadframe 151, and the connecting portions 231 h, 232 h, and 235 h of thelead frame 201 are simultaneously cut. A dicing saw may be used for thecutting, for example. As a result of this, a plurality of singulatedlight emitting devices 101 are produced.

Although the present embodiment illustrates the each fiber member as abundle of fibers in the figures, any of the aforementioned variety offiber members can be used. For example, as shown in FIG. 6, holes may beformed in a knotless net, or a sheet-shaped fiber member such as areticulated fiber or nonwoven fabric, and portions corresponding to theplurality of fiber members 40 arrayed along the x axis direction andthey axis direction as illustrated in FIG. 5B may be formed therein.Using such a member will make it unnecessary to align a plurality offiber members 40, thereby facilitating the production of theresin-attached lead frame 151.

Second Embodiment

A second embodiment of a light emitting device according to the presentdisclosure will be described. The light emitting device according to thesecond embodiment is identical to the light emitting device according tothe first embodiment, except mainly for a base body having a differentstructure. Therefore, the structure of the base body will be mainlydescribed.

FIGS. 7A, 7B, 7C, and 7D are a plan view, a side view, a front view, anda bottom view, respectively, of a base body 12 used in the lightemitting device according to the second embodiment; and FIGS. 7E and 7Fare cross-sectional views of the base body 12 taken at line 7E-7E andline 7F-7F, respectively, in FIG. 7A.

End faces of extending portions 31 h and 32 h of the base body 12 areexposed at an outer lateral face 10 e of an interconnecting portion 21 eand an outer lateral face 10 f of an interconnecting portion 21 f, butare not exposed at an outer lateral face 10 c of a sandwiching portion21 c and an outer lateral face 10 d of a sandwiching portion 21 d. Inother words, the extending portions 31 h and 32 h are not provided inthe sandwiching portions 21 c and 21 d. Moreover, fiber members 40 areembedded in the sandwiching portions 21 c and 21 d, but not embedded inthe interconnecting portions 21 e and 21 f. In other words, the fibermembers 40 are not provided under the extending portions 31 h and 32 h.

The fiber members 40 are located inside the adjoining regions 21 cr and21 dr of the sandwiching portions 21 c and 21 d, and extend along thedirection that the sandwiching portion 21 c or 21 d extends. In otherwords, the fiber members 40 extend in a direction which isnon-orthogonal to the direction that the sandwiching portion 21 c or 21d extends. This enhances the strength of the base body 11, as has beendescribed in the first embodiment.

FIG. 8A and FIG. 8B are an upper plan view and a lower plan view,respectively, of a resin-attached lead frame 152 in which such basebodies 12 are integrated. FIG. 9A and FIG. 9B are an upper plan view anda lower plan view, respectively, of a lead frame 202 which is used inthe resin-attached lead frame 152; and FIG. 9C is a partially enlargedview of the lower plan view. In these figures, the upward directionalong the vertical direction is represented as the y axis, whereas therightward direction, which is perpendicular to the y axis, isrepresented as the x axis.

The resin-attached lead frame 152 differs from the resin-attached leadframe 151 with respect to the structure of the lead frame 202 andplacement of the fiber members 40.

In the lead frame 202, each first conductive subportion 231 is connectedto the second conductive subportion 232 of an adjacent conductiveportion 230, along the x axis direction, by two connecting portions 235h (see FIG. 9A). The connecting portions 235 h are connected by aconnecting portion 234 h, along the y axis direction. Each firstconductive subportion 231 and each second conductive subportion 232 arenot connected, via any connecting portion, to an adjacent firstconductive subportion 231 and an adjacent second conductive subportion232 along the y axis direction. Therefore, before an insert molding,when fiber members 40 extending along the x axis direction are to beplaced along the first conductive subportions 231 and the secondconductive subportions 232, which themselves are alternately arrangedalong the x axis direction, there is no structure to stably support thefiber members 40 near each first conductive subportion 231 and eachsecond conductive subportion 232.

In the present embodiment, in order to support the fiber members 40, thelead frame 202 includes an outer frame portion 240 that surrounds aplural sets of conductive members 30, and a plurality of hooks 241located inside the outer frame portion 240 (see FIGS. 9B and 9C). In thepresent embodiment, each hook 241 is shaped as a protrusion from thelower face 202 b of the lead frame 202, the hook 241 protruding in the zaxis direction from the surroundings; specifically, a recess 242 isprovided around each hook 241 of the outer frame portion 240. As aresult, at the positions of the hooks 241, the lead frame 202 has thesame thickness as that of the outer frame portion 240; in the recesses242, however, the lead frame 202 has a smaller thickness than that ofthe outer frame portion 240. By engaging the fiber members 40 on thehooks 241, the fiber members 40 can be placed near the first conductivesubportions 231 and the second conductive subportions 232. For example,the hooks 241 may be placed inside the outer frame portion 240 in such amanner that plural sets of conductive members 30 that are arranged alongthe x axis direction are interposed therebetween.

Except for the placement of the fiber members 40, the resin-attachedlead frame 152 can be produced in a manner similar to the resin-attachedlead frame 151 according to the first embodiment.

First, the lead frame 202, having the hooks 241 as shown in FIG. 9A andFIG. 9B provided therein, is produced. Thereafter, as shown in FIG. 10,the fiber members 40 are engaged on the hooks 241 of the lead frame 202.In order to prevent loosening of the fiber members 40 engaged on thehooks 241, before engagement of the fiber members 40 onto the hooks 241,the fiber members 40 may be impregnated with an uncured resin material,and after the fiber members 40 are engaged on the hooks 241, preliminarycuring of the resin material may be effected. This suppresses flexure ofthe fiber members 40, thereby allowing the fiber members 40 to be stablyplaced relative to the lead frame 202. Thereafter, the lead frame 202having the fiber members 40 attached thereto may be sandwiched betweenupper and lower dies, and subjected to an insert molding where resin isinjected for integration, whereby the resin-attached lead frame 152 canbe obtained.

Although the present embodiment illustrates the hooks 241 as protrusionsin the z axis direction, the lead frame 202 may include any other typeof hooks. For example, the hooks may be protrusions, bumps, etc.,extending in the y axis direction; the fiber members 40 can also beengaged on these.

Third Embodiment

A third embodiment of a light emitting device according to the presentdisclosure will be described. The light emitting device according to thethird embodiment is identical to the light emitting device according tothe first embodiment, except mainly for a base body having a differentstructure. Therefore, the structure of the base body will be mainlydescribed.

FIGS. 11A, 11B, 11C, and 11D are a plan view, a side view, a rear view,and a bottom view, respectively, of a base body 13 used in the lightemitting device according to the third embodiment; and FIGS. 11E, 11F,11G, and 11H are cross-sectional views of the base body 13 taken at line11E-11E, line 11F-11F, line 11G-11G, and line 11H-11H respectively, inFIG. 11A.

In addition to a first conductive member 31 and a second conductivemember 32, the base body 13 includes a third conductive member 33. Apart of an upper face 33 a of the third conductive member 33 is exposedat the bottom face in a recess 11 r, whereas a part of a lower face 33 bis exposed at a lower face 10 b of the base body 13. In addition to anisolation section 21 j, a resin body 20 includes an isolation section 21k, such that a sandwiching portions 21 c and 21 d sandwich the isolationsections 21 j and 21 k. Therefore, the sandwiching portion 21 c includestwo adjoining regions 21 cr respectively adjoining the isolationsections 21 j and 21 k. Similarly, the sandwiching portion 21 d includestwo adjoining regions 21 dr respectively adjoining the isolationsections 21 j and 21 k. Fiber members 40 are placed inside therespective adjoining regions 21 cr and 21 dr, and extend in a directionwhich is non-orthogonal to the direction that the sandwiching portion 21c or 21 d extends.

Inside the adjoining region 21 cr or 21 dr adjoining the isolationsection 21 j, each fiber member 40 includes a second fiber portion 40 bwhich is located beneath the extending portions 31 h and 32 h and afirst fiber portion 40 a which is located on the extending portions 31 hand 32 h. Between the extending portions 31 h and 32 h, the second fiberportion 40 b and the first fiber portion 40 a come in contact with eachother. Similarly, inside the adjoining region 21 cr or 21 dr adjoiningthe isolation section 21 k, each fiber member 40 includes a second fiberportion 40 b which is located beneath the extending portions 31 h and 33h and a first fiber portion 40 a which is located on the extendingportions 31 h and 33 h. Between the extending portions 31 h and 33 h,the second fiber portion 40 b and the first fiber portion 40 a come incontact with each other.

The two fiber members 40 located inside the adjoining regions 21 cr and21 dr adjoining the isolation section 21 j are separated from the twofiber members 40 located inside the adjoining regions 21 cr and 21 dradjoining the isolation section 21 k. Moreover, the end faces of thefiber members 40 are not exposed at an outer lateral face 10 e and anouter lateral face 10 f; rather, the end faces of the fiber members 40are located inside the resin body 20.

The base body 13 includes three conductive members. Therefore, the lightemitting device according to the third embodiment can be used as a3-terminal device, and may be implemented as, for example, a lightemitting device having two light-emitting elements.

Moreover, as in the first and second embodiments, the fiber members 40are located inside the adjoining regions 21 cr and 21 dr of thesandwiching portions 21 c and 21 d, and extend along the direction thatthe sandwiching portion 21 c or 21 d extends. This enhances the strengthof the base body 13. Furthermore, each fiber member 40 includes twofiber portions which are disposed so as to sandwich two extendingportions from above and below, and yet come in contact with each otherin between the extending portions. Thus, fiber members 40 can be fixedlyplaced onto the extending portions. This allows the fiber members 40 tobe arranged only in places where the strength of the base body 13 islikely to deteriorate, thereby reducing the amount of fiber members 40used. Moreover, an implementation is possible such that the fibermembers 40 are not exposed at the outer lateral faces. Therefore, nointerfaces between the fiber members 40 and the resin body 20 arecreated at the outer lateral faces, whereby the hermeticity andenvironmental resistance of the base body 13 can be enhanced.

A resin-attached lead frame 152 in which such base bodies 13 areintegrated can be produced by placing fiber members 40 having theaforementioned characteristic aspects on a lead frame. Hereinafter, aresin-attached lead frame according to the present embodiment will bedescribed mainly with respect to the placement of the lead frame and thefiber members. FIG. 12A and FIG. 12B are an upper plan view and a lowerplan view, respectively, of a lead frame 203 which is used for theresin-attached lead frame according to the present embodiment.

In the lead frame 203, the conductive portions 230, which are arrangedalong the x axis direction, include: first conductive subportions 231 tobecome the first conductive members 31; second conductive subportions232 to become the second conductive members 32; and third conductivesubportions 233 to become the third conductive members 33. Every secondconductive subportion 232 and every third conductive subportion 233 arearranged so that a first conductive subportion 231 is interposedtherebetween. Each second conductive subportion 232 is connected to thethird conductive subportion 233 of an adjacent conductive portion 230along the x axis direction, via a connecting portion (first connectingportion) 235 h. Each first conductive subportion 231, each secondconductive subportion 232, and each third conductive subportion 233 areconnected to the first conductive subportion 231, the second conductivesubportion 232, and the third conductive subportion 233 of an adjacentconductive portion 230 along the y axis direction, respectively, viaconnecting portions (second connecting portions) 231 h, 232 h, and 233h. The connecting portion 231 hs, 232 h, and 233 h correspond to theextending portions 31 h, 32 h, and 33 h, respectively.

FIG. 13A and FIG. 13B are, respectively, an upper plan view and a lowerplan view showing enlarged some fiber members 40 being placed on thelead frame 203. The first fiber portions 40 a of the fiber members 40are located astride the connecting portions 231 h and the connectingportions 232 h from above, whereas the second fiber portions 40 b of thefiber members 40 are located astride the connecting portions 231 h andthe connecting portions 232 h from below. Each first fiber portion 40 ais adhesively bonded to the corresponding second fiber portion 40 b, inbetween the connecting portion 231 h and the connecting portion 232 h.On the other hand, the first fiber portions 40 a of the fiber members 40are located astride the connecting portions 231 h and the connectingportions 233 h from above, whereas the second fiber portions 40 b of thefiber members 40 are located astride the connecting portions 231 h andthe connecting portions 233 h from below. Each first fiber portion 40 ais adhesively bonded to the corresponding second fiber portion 40 b, inbetween the connecting portion 231 h and the connecting portion 233 h.

FIG. 13A and FIG. 13B indicate with dot-dash lines the cut lines to beused when the resin-attached lead frame is singulated into separate basebodies 13. Although the first fiber portions 40 a and the second fiberportions 40 b are placed between a plurality of dot-dash lines extendingalong the x axis direction and the y axis direction, the first fiberportions 40 a and the second fiber portions 40 b never intersect the cutlines. Such placement prevents cross sections of the fiber members 40from becoming exposed at the outer lateral faces when the resin-attachedlead frame is singulated. Because the fiber members 40 do not need to becut during singulation, cutting is also made easier.

The aforementioned arrangement of fiber members 40 can be obtained byusing, for example, so-called pre-pregs, i.e., fiber members impregnatedwith resin and semi-cured, or fiber members impregnated with uncuredresin.

For example, semi-cured first fiber portions 40 a and second fiberportions 40 b may be placed above and below the connecting portions 231h and the connecting portions 232 h, and above and below the connectingportions 231 h and the connecting portions 233 h. While keeping eachfirst fiber portion 40 a and the corresponding second fiber portions 40b in contact with each other in between the connecting portions, theymay be subjected to heating, thereby curing and joining them.Thereafter, the lead frame 203 having the fiber members 40 placedthereon may be sandwiched between dies, and subjected to an insertmolding and resin curing as has been described in the first embodiment,whereby the resin-attached lead frame 153 can be produced.

Fourth Embodiment

A fourth embodiment of a light emitting device according to the presentdisclosure will be described. The light emitting device according to thefourth embodiment is identical to the light emitting device according tothe first embodiment, except mainly for a base body having a differentstructure. Therefore, the structure of the base body will be mainlydescribed.

FIGS. 14A, 14B, 14C, and 14D are a plan view, a side view, a front view,and a bottom view, respectively, of a base body 14 used in the lightemitting device according to the fourth embodiment; and FIGS. 14E and14F are cross-sectional views of the base body 14 taken at line 14E-14Eand line 14F-14F, respectively, in FIG. 14A.

As in the first embodiment, a resin body 20 of the base body 14 includessandwiching portions 21 c and 21 d, interconnecting portions 21 e and 21f, and an isolation section 21 j. Fiber members 40 are only placed inthe sandwiching portions 21 c and 21 d. Each fiber member 40 includes afirst fiber portion 40 a and a second fiber portion 40 b. The firstfiber portion 40 a is placed above two extending portions 31 h and anextending portion 32 h, whereas the second fiber portion 40 b is placedbelow the two extending portions 31 h and the extending portion 32 h. Inbetween the two extending portions 31 h and between the extendingportions 31 h and 32 h, the first fiber portion 40 a and the secondfiber portion 40 b are engaged with each other. More specifically, inbetween the two extending portions 31 h and between the extendingportions 31 h and 32 h, the first fiber portion 40 a is located belowthe second fiber portion 40 b, and the second fiber portion 40 b islocated above the first fiber portion 40 a, such that the first fiberportion 40 a and the second fiber portion 40 b intertwine each other.

Since the base body 14 includes the fiber members 40, the strength ofthe base body 14 is enhanced, as in the first embodiment. Moreover,since the first fiber portion 40 a and the second fiber portion 40 bintertwine each other, the first fiber portion 40 a and the second fiberportion 40 b are less likely to become detached from the resin body 20,even if the end faces of the first fiber portion 40 a and the secondfiber portion 40 b may be exposed at an outer lateral face 10 e and anouter lateral face 10 f.

The aforementioned placement of the fiber members 40 can be achieved byfor example, using a sewing machine in order to place the first fiberportions 40 a and the second fiber portions 40 b on the lead frame 204.FIG. 15A is an upper plan view of the fiber members 40 being placed onthe lead frame 204 for obtaining a resin-attached lead frame in whichthe base bodies 14 are integrated; and FIG. 15B is a cross-sectionalview of the lead frame 204 taken at line 15B-15B in FIG. 15A. In thelead frame 204, each first conductive subportion 231 (corresponding tothe first conductive member 31) is connected to the first conductivesubportion 231 of an adjacent conductive portion 230 along the y axisdirection by two connecting portions 231 h (corresponding to theextending portions 31 h). Moreover, each second conductive subportion232 (corresponding to the second conductive member 32) is connected tothe second conductive subportion 232 of an adjacent conductive portion230 along they axis direction by a connecting portion 232 h(corresponding to the extending portion 32 h).

The first fiber portions 40 a and the second fiber portions 40 b areplaced on both sides of each column of plural sets of conductive members30 arranged along the x axis direction. Each first fiber portion 40 a isplaced above two connecting portions 231 h and a connecting portion 232h, whereas each second fiber portion 40 b is placed below the twoconnecting portions 231 h and the connecting portion 232 h. Between thetwo connecting portions 231 h and between the connecting portions 231 hand 232 h, the first fiber portion 40 a is located below the secondfiber portion 40 b, and the second fiber portion 40 b is located abovethe first fiber portion 40 a, such that the first fiber portion 40 a andthe second fiber portion 40 b intertwine each other.

The aforementioned placement of the first fiber portions 40 a and thesecond fiber portions 40 b can be achieved by, while utilizing the firstfiber portions 40 a and the second fiber portions 40 b respectively asan upper thread and a lower thread, for example, using a sewing machinefor industrial use to yield the first fiber portions 40 a and the secondfiber portions 40 b in a manner of sewing the two connecting portions231 h and the connecting portions 232 h along the x axis direction. Byallowing the first fiber portion 40 a and the second fiber portion 40 bto intersect each other between connecting portions, the fiber members40 can be stably placed on the lead frame 204. This facilitates handlingof the lead frame 204 having the fiber members 40 placed thereon.

Fifth Embodiment

A fifth embodiment of a light emitting device according to the presentdisclosure will be described. The light emitting device according to thefifth embodiment is identical to the light emitting device according tothe first embodiment, except mainly for a base body having a differentstructure. Therefore, the structure of the base body will be mainlydescribed.

FIGS. 16A, 16B, 16C, and 16D are a plan view, a side view, a front view,and a bottom view, respectively, of the light emitting device 105according to the fifth embodiment; and FIG. 16E is a cross-sectionalview of the light emitting device 105 taken at line 16E-16E in FIG. 16A.FIGS. 17A, 17B, 17C, and 17D are a plan view, a side view, a front view,and a bottom view, respectively, of a base body 15 used in the lightemitting device 105 according to the fifth embodiment; and FIGS. 17E and17F are cross-sectional views of the base body 15 taken at line 17E-17Eand line 17F-17F, respectively, in FIG. 17A.

The base body 15 has no recesses, and its upper face 10 a and lower face10 b are flat. As a result, a sealing member 60 is located so as tocover the entire upper face 10 a. Moreover, a first conductive member 31and a second conductive member 32 are different from those of the lightemitting device according to the first embodiment. Except for its fourround corners, the edge of an upper face 31 a of the first conductivemember 31 consists of: a long straight line; a short straight line whichis perpendicular to the long straight line; a medium-lengthed straightline which is parallel to the long straight line and perpendicular tothe short straight line; and an inwardly-convex curve. Except for itsthree round corners, the edge of an upper face 32 a of the secondconductive member 32 consists of: a long straight line; a short straightline; and an outwardly-convex curve. The shape of a resin body 20 isrectangular in top view. Therefore, an isolation section 26 j locatedbetween the first conductive member 31 and the second conductive member32 has a curve shape, and is located, in top view, so as to extendbetween two adjacent sides among the four sides of the rectangle. Theresin body 20 includes sandwiching portions 26 c and 26 f andinterconnecting portions 26 e and 26 d. Even though the sandwichingportions 26 c and 26 f sandwich the isolation section 26 j, thesandwiching portion 26 c and the sandwiching portion 26 f are located ontwo adjacent sides of the rectangle. The direction that the sandwichingportion 26 c extends and the direction that the sandwiching portion 26 fextends are orthogonal to each other; and since the sandwiching portions26 c and 26 f are connected to each other at one end, the sandwichingportions 26 c and 26 f together present an “L” shape. Moreover, theinterconnecting portion 26 e and the interconnecting portion 26 d arelocated on two adjacent sides of the rectangle. The direction that theinterconnecting portion 26 e extends and the direction that theinterconnecting portion 26 d extends are orthogonal to each other; andsince the interconnecting portions 26 e and 26 d are connected at oneend to each other, the interconnecting portions 26 e and 26 d togetherpresent an “L” shape. As the two “L” shapes are connected to each otherat both ends, they together present the rectangular shape.

The sandwiching portions 26 c and 26 f have adjoining regions 26 cr and26 fr, respectively, each adjoining the isolation section 26 j.

Each fiber member 40 is located inside the adjoining region 26 cr or theadjoining region 26 fr of at least one of the sandwiching portions 26 cand 26 f, and, inside the respective adjoining region 26 cr or 26 fr,extends in a direction which is non-orthogonal to the direction that thesandwiching portion 26 c or 26 f extends.

In the first conductive member 31, four extending portions 31 h areprovided, such that an end face of one extending portion 31 h is exposedat each of an outer lateral face 10 c and an outer lateral face 10 e. Onthe other hand, end faces of two extending portions 31 h are exposed atan outer lateral face 10 d. The second conductive member 32 includes twoextending portions 32 h, such that an end face of one extending portion32 h is exposed at each of the outer lateral face 10 c and an outerlateral face 10 f.

In the present embodiment, fiber members 40 are located inside both ofthe adjoining regions 26 cr and 26 fr of the sandwiching portions 26 cand 26 f More specifically, the base body 15 includes four fiber members40, which are respectively embedded inside the sandwiching portions 26 cand 26 f and the interconnecting portions 26 e and 26 d, along therespective directions that the sandwiching portions 26 c and 26 f andthe interconnecting portions 26 e and 26 d extend. Since the fibermembers 40 are embedded along the directions that the sandwichingportions 26 c and 26 f extend, as in the first embodiment, the strengthof the base body 15 is enhanced in the adjoining regions 26 cr and 26 frof the sandwiching portions 26 c and 26 f being connected to theisolation section 26 j, where stress is likely to concentrate.

A resin-attached lead frame in which the base bodies 15 are integratedcan be produced in a similar manner to the first embodiment. By usingthe resin-attached lead frame having been produced, a light emittingdevice 105 can be produced in a similar manner to the first embodiment.Unlike in the first embodiment, though, the latticework portion of theresin-attached lead frame 155 has no recesses.

FIG. 18 shows enlarged the placement of the lead frame 205 and the fibermembers 40 in the resin-attached lead frame in which the base bodies 15are integrated. In the lead frame 205, conductive portions 230 arearranged in a two-dimensional array along the x axis direction and the yaxis direction. Each first conductive subportion 231 and each secondconductive subportion 232 are connected via a connecting portion 235 hextending along the x axis direction. Sets of the first conductivesubportion 231 and the second conductive subportion 232 being connectedto each other are arranged along the x axis direction, via gaps in whichthe isolation sections 26 j are placed.

Each first conductive subportion 231 is connected to an adjacent firstconductive subportion 231 on the right side along the y axis directionby a connecting portion 231 h, and connected to an adjacent secondconductive subportion 232 on the right side along the y axis directionby a connecting portion 236 h.

The fiber members 40 are placed so as to fit around the respectiveconductive portions 230. Specifically, two fiber members 40 extendingalong the x axis direction are placed so that a column of conductiveportions 230 arranged along the x axis direction is interposedtherebetween. Moreover, two fiber members 40 extending along the y axisdirection are placed so that a row of conductive portions 230 arrangedalong the y axis direction is interposed therebetween. Each of suchfiber members 40 may be an independent monofilament or a bundle offibers, or they may together constitute a knotless net.

Using the resin-attached lead frame 155, a light emitting device 105 canbe produced by a method similar to the method which was described in thefirst embodiment.

A light emitting device according to the present disclosure can besuitably used for various light sources, e.g., light sources forillumination purposes, light sources for various indicators, lightsources for displays, light sources in the backlights of liquid crystaldisplays, traffic lights, onboard parts for vehicles, channel lettersfor signage use, and so on.

While exemplary embodiments of the present invention have been describedabove, it will be apparent to those skilled in the art that thedisclosed invention may be modified in numerous ways and may assume manyembodiments other than those specifically described above. Accordingly,it is intended by the appended claims to cover all modifications of theinvention that fall within the true spirit and scope of the invention.

What is claimed is:
 1. A light emitting device comprising: a base bodyincluding two conductive members each having an upper face and a lowerface, a resin body covering a part of each conductive member, and afiber member placed inside the resin body, a part of the upper face ofeach conductive member being exposed from the resin body at an upperside of the base body, and a part of the lower face of each conductivemember being exposed from the resin body at a lower side of the basebody; and a light-emitting element electrically connected to the twoconductive members, wherein, the resin body includes an isolationsection located between the two conductive members, and includes a pairof sandwiching portions sandwiching the isolation section; the fibermember has a length which is greater than a distance between the twoconductive members, and is located at least in an adjoining region of atleast one of the pair of sandwiching portions, the adjoining regionadjoining the isolation section; and, in the adjoining region, the fibermember extends in a direction which is non-orthogonal to a direction inwhich the pair of sandwiching portions extend, wherein, each sandwichingportion has an outer lateral face; the two conductive members eachinclude an extending portion, the extending portion extending toward theouter lateral face of one of the pair of sandwiching portions and havingan end face which is exposed at said outer lateral face; and the fibermember includes a first fiber portion located downward of the extendingportion.
 2. The light emitting device of claim 1, wherein the fibermember further includes a second fiber portion located upward of theextending portion.
 3. The light emitting device of claim 2, wherein thefirst fiber portion and the second fiber portion come in contact witheach other in between the extending portions of the two conductivemembers.
 4. The light emitting device of claim 1, wherein, the resinbody includes a pair of interconnecting portions interconnecting thesandwiching portions; and each of the pair of interconnecting portionshas an outer lateral face, an end face of the fiber member being exposedat the outer lateral face of one of the pair of interconnectingportions.
 5. The light emitting device of claim 1, wherein an end faceof the fiber member is located inside the resin body.
 6. The lightemitting device of claim 2, wherein, the resin body includes a pair ofinterconnecting portions interconnecting the sandwiching portions; andeach of the pair of interconnecting portions has an outer lateral face,an end face of the fiber member being exposed at the outer lateral faceof one of the pair of interconnecting portions.
 7. The light emittingdevice of claim 2, wherein an end face of the fiber member is locatedinside the resin body.
 8. The light emitting device of claim 3, wherein,the resin body includes a pair of interconnecting portionsinterconnecting the sandwiching portions; and each of the pair ofinterconnecting portions has an outer lateral face, an end face of thefiber member being exposed at the outer lateral face of one of the pairof interconnecting portions.
 9. The light emitting device of claim 3,wherein an end face of the fiber member is located inside the resinbody.
 10. A resin-attached lead frame, comprising: a lead frame; a resinmember; a plurality of fiber members; and a plurality of additionalfiber members, wherein the lead frame includes: a plurality ofconductive portions arrayed along a first direction and a seconddirection which intersects the first direction, each conductive portionhaving an upper face and a lower face in relation to a third directionwhich is perpendicular to the first direction and the second direction,and each conductive portion including first and second conductivesubportions in a plane containing the first direction and the seconddirection, the first and second conductive subportions being arrangedalong the first direction and spaced apart from each other by a gap; anda plurality of connecting portions connecting between the plurality ofconductive portions along the first direction and along the seconddirection, wherein the resin member includes: a plurality of isolationportions each placed in the gap between the first and second conductivesubportions; and a latticework portion placed between the plurality ofconductive portions so as to surround each conductive portion whileleaving a part of the upper face and a part of the lower face of theconductive portion exposed, the latticework portion including aplurality of first portions extending along the first direction and aplurality of second portions extending along the second direction,wherein the plurality of fiber members each has a length which isgreater than a distance between the first and second conductivesubportions, wherein, in the resin member, one end of each isolationportion is connected to a corresponding one of the plurality of firstportions, wherein one of the plurality of fiber members is located atleast in an adjoining region of the first portion to which eachisolation portion is connected, the adjoining region adjoining theisolation portion, the one of the plurality of fiber members extendingwithin the adjoining region in a direction which is non-orthogonal tothe first direction, and wherein, the latticework portion of the resinmember includes a plurality of second portions extending along thesecond direction; the plurality of additional fiber members are embeddedin the plurality of second portions; and the fiber members and theplurality of additional fiber members constitute a knotless net.
 11. Theresin-attached lead frame of claim 10, wherein, the lead frame includesan outer frame portion surrounding the plurality of conductive portionsarrayed along the first and second directions, and a plurality of hookslocated inside the outer frame portion; and the plurality of fibermembers are engaged on and supported by the plurality of hooks.
 12. Theresin-attached lead frame of claim 10, wherein the plurality of fibermembers are impregnated with a resin, and the resin has been cured. 13.The resin-attached lead frame of claim 11, wherein the plurality offiber members are impregnated with a resin, and the resin has beencured.
 14. A resin-attached lead frame, comprising: a lead frame; aresin member; and a plurality of fiber members, wherein the lead frameincludes: a plurality of conductive portions arrayed along a firstdirection and a second direction which intersects the first direction,each conductive portion having an upper face and a lower face inrelation to a third direction which is perpendicular to the firstdirection and the second direction, and each conductive portionincluding first and second conductive subportions in a plane containingthe first direction and the second direction, the first and secondconductive subportions being arranged along the first direction andspaced apart from each other by a gap; and a plurality of connectingportions connecting between the plurality of conductive portions alongthe first direction and along the second direction, wherein the resinmember includes: a plurality of isolation portions each placed in thegap between the first and second conductive subportions; and alatticework portion placed between the plurality of conductive portionsso as to surround each conductive portion while leaving a part of theupper face and a part of the lower face of the conductive portionexposed, the latticework portion including a plurality of first portionsextending along the first direction and a plurality of second portionsextending along the second direction, wherein the plurality of fibermembers each has a length which is greater than a distance between thefirst and second conductive subportions, wherein, in the resin member,one end of each isolation portion is connected to a corresponding one ofthe plurality of first portions, wherein one of the plurality of fibermembers is located at least in an adjoining region of the first portionto which each isolation portion is connected, the adjoining regionadjoining the isolation portion, the one of the plurality of fibermembers extending within the adjoining region in a direction which isnon-orthogonal to the first direction, wherein, the lead frame includesan outer frame portion surrounding the plurality of conductive portionsarrayed along the first and second directions, and a plurality of hookslocated inside the outer frame portion; and the plurality of fibermembers are engaged on and supported by the plurality of hooks.
 15. Theresin-attached lead frame of claim 14, wherein, in the resin member,another end of each isolation portion is connected to another one of theplurality of first portions; and another one of the plurality of fibermembers is located at least in an adjoining region of the other firstportion to which each isolation portion is connected, the adjoiningregion adjoining the isolation portion, the another one of the pluralityof fiber members extending within the adjoining region in a directionwhich is non-orthogonal to the first direction.
 16. The resin-attachedlead frame of claim 15, wherein the plurality of fiber members areimpregnated with a resin, and the resin has been cured.
 17. Theresin-attached lead frame of claim 14, further comprising a plurality ofadditional fiber members, wherein, the latticework portion of the resinmember includes a plurality of second portions extending along thesecond direction; in the resin member, another end of each isolationportion is connected to the second portion; and one of the plurality ofadditional fiber members is located at least in an adjoining region ofthe second portion to which each isolation portion is connected, theadjoining region adjoining the isolation portion, the one of theplurality of additional fiber members extending within the adjoiningregion in a direction which is non-orthogonal to the second direction.18. The resin-attached lead frame of claim 17, wherein the plurality offiber members are impregnated with a resin, and the resin has beencured.
 19. The resin-attached lead frame of claim 14, wherein theplurality of fiber members are impregnated with a resin, and the resinhas been cured.
 20. The resin-attached lead frame of claim 14, wherein,the plurality of connecting portions of the lead frame include firstconnecting portions each connecting the first conductive subportion of aconductive portion to the second conductive subportion of an adjacentconductive portion along the first direction, and second connectingportions each connecting the first and second conductive subportions ofa conductive portion to the first and second conductive subportions ofan adjacent conductive portion along the second direction; each fibermember includes a first fiber portion that is located above thecorresponding second connecting portion and a second fiber portionlocated below the corresponding second connecting portion.
 21. Theresin-attached lead frame of claim 20, wherein, in the resin member,another end of each isolation portion is connected to another one of theplurality of first portions; and another one of the plurality of fibermembers is located at least in an adjoining region of the other firstportion to which each isolation portion is connected, the adjoiningregion adjoining the isolation portion, the another one of the pluralityof fiber members extending within the adjoining region in a directionwhich is non-orthogonal to the first direction.
 22. The resin-attachedlead frame of claim 21, wherein the plurality of fiber members areimpregnated with a resin, and the resin has been cured.
 23. Theresin-attached lead frame of claim 20, further comprising a plurality ofadditional fiber members, wherein, the latticework portion of the resinmember includes a plurality of second portions extending along thesecond direction; in the resin member, another end of each isolationportion is connected to the second portion; and one of the plurality ofadditional fiber members is located at least in an adjoining region ofthe second portion to which each isolation portion is connected, theadjoining region adjoining the isolation portion, the one of theplurality of additional fiber members extending within the adjoiningregion in a direction which is non-orthogonal to the second direction.24. The resin-attached lead frame of claim 23, wherein the plurality offiber members are impregnated with a resin, and the resin has beencured.
 25. The resin-attached lead frame of claim 20, wherein theplurality of fiber members are impregnated with a resin, and the resinhas been cured.
 26. The resin-attached lead frame of claim 20, wherein,the latticework portion of the resin member includes a plurality ofsecond portions extending along the second direction; and in betweensecond connecting portions, the first fiber portion and the second fiberportion are adhesively bonded to each other.
 27. The resin-attached leadframe of claim 26, wherein the plurality of fiber members areimpregnated with a resin, and the resin has been cured.
 28. Aresin-attached lead frame, comprising: a lead frame; a resin member; anda plurality of fiber members, wherein the lead frame includes: aplurality of conductive portions arrayed along a first direction and asecond direction which intersects the first direction, each conductiveportion having an upper face and a lower face in relation to a thirddirection which is perpendicular to the first direction and the seconddirection, and each conductive portion including first and secondconductive subportions in a plane containing the first direction and thesecond direction, the first and second conductive subportions beingarranged along the first direction and spaced apart from each other by agap; and a plurality of connecting portions connecting between theplurality of conductive portions along the first direction and along thesecond direction, wherein the resin member includes: a plurality ofisolation portions each placed in the gap between the first and secondconductive subportions; and a latticework portion placed between theplurality of conductive portions so as to surround each conductiveportion while leaving a part of the upper face and a part of the lowerface of the conductive portion exposed, the latticework portionincluding a plurality of first portions extending along the firstdirection and a plurality of second portions extending along the seconddirection, wherein the plurality of fiber members each has a lengthwhich is greater than a distance between the first and second conductivesubportions, wherein, in the resin member, one end of each isolationportion is connected to a corresponding one of the plurality of firstportions, wherein one of the plurality of fiber members is located atleast in an adjoining region of the first portion to which eachisolation portion is connected, the adjoining region adjoining theisolation portion, the one of the plurality of fiber members extendingwithin the adjoining region in a direction which is non-orthogonal tothe first direction, and wherein, the plurality of connecting portionsof the lead frame include first connecting portions each connecting thefirst conductive subportion of a conductive portion to the secondconductive subportion of an adjacent conductive portion along the firstdirection, second connecting portions each connecting the first andsecond conductive subportions of a conductive portion to the first andsecond conductive subportions of an adjacent conductive portion alongthe second direction; and each fiber member includes a first fiberportion that is located above the corresponding second connectingportion and a second fiber portion located below the correspondingsecond connecting portion.
 29. The resin-attached lead frame of claim28, wherein, in the resin member, another end of each isolation portionis connected to another one of the plurality of first portions; andanother one of the plurality of fiber members is located at least in anadjoining region of the other first portion to which each isolationportion is connected, the adjoining region adjoining the isolationportion, the another one of the plurality of fiber members extendingwithin the adjoining region in a direction which is non-orthogonal tothe first direction.
 30. The resin-attached lead frame of claim 28,further comprising a plurality of additional fiber members, wherein, thelatticework portion of the resin member includes a plurality of secondportions extending along the second direction; in the resin member,another end of each isolation portion is connected to the secondportion; and one of the plurality of additional fiber members is locatedat least in an adjoining region of the second portion to which eachisolation portion is connected, the adjoining region adjoining theisolation portion, the one of the plurality of additional fiber membersextending within the adjoining region in a direction which isnon-orthogonal to the second direction.
 31. The resin-attached leadframe of claim 28, wherein, the latticework portion of the resin memberincludes a plurality of second portions extending along the seconddirection; in between second connecting portions, the first fiberportion and the second fiber portion are adhesively bonded to eachother; and each of the plurality of second portions of the latticeworkportion has the first fiber portion and the second fiber portion locatedtherein, such that the first fiber portion and the second fiber portionare placed between a plurality of cut lines extending along the seconddirection but do not intersect the cut lines.
 32. The resin-attachedlead frame of claim 28, wherein the plurality of fiber members areimpregnated with a resin, and the resin has been cured.
 33. Theresin-attached lead frame of claim 29, wherein the plurality of fibermembers are impregnated with a resin, and the resin has been cured. 34.The resin-attached lead frame of claim 30, wherein the plurality offiber members are impregnated with a resin, and the resin has beencured.
 35. The resin-attached lead frame of claim 31, wherein theplurality of fiber members are impregnated with a resin, and the resinhas been cured.
 36. A resin-attached lead frame, comprising: a leadframe; a resin member; and a plurality of fiber members, wherein thelead frame includes: a plurality of conductive portions arrayed along afirst direction and a second and direction which intersects the firstdirection, each conductive portion having an upper face and a lower facein relation to a third direction which is perpendicular to the firstdirection and the second direction, and each conductive portionincluding first and second conductive subportions in a plane containingthe first direction and the second direction, the first and secondconductive subportions being arranged along the first direction andspaced apart from each other by a gap; and a plurality of connectingportions connecting between the plurality of conductive portions alongthe first direction and along the second direction, wherein the resinmember includes: a plurality of isolation portions each placed in thegap between the first and second conductive subportions; and alatticework portion placed between the plurality of conductive portionsso as to surround each conductive portion while leaving a part of theupper face and a part of the lower face of the conductive portionexposed, the latticework portion including a plurality of first portionsextending along the first direction and a plurality of second portionsextending along the second direction, wherein the plurality of fibermembers each has a length which is greater than a distance between thefirst and second conductive subportions, wherein, in the resin member,one end of each isolation portion is connected to a corresponding one ofthe plurality of first portions, wherein one of the plurality of fibermembers is located at least in an adjoining region of the first portionto which each isolation portion is connected, the adjoining regionadjoining the isolation portion, the one of the plurality of fibermembers extending within the adjoining region in a direction which isnon-orthogonal to the first direction, and wherein the one fiber memberis located downward of at least one of the plurality of connectingportions.